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IPO Detail
02631 天岳先進
SICC
Listing Date2025/08/20
Listing Price42.800
 
Quote
Subscription Result
  • Subscription Rate
    2,809.19x
  • Guarantee One Lot Size
    500 lot
  • One Lot Success Rate
    30%
COMPANY PROFILE

SICC CO is a company with strong expertise in the wide bandgap semiconductor material industry, focusing on the research, development and industrialization of SiC substrates since its inception. According to Frost & Sullivan, based on revenue from SiC substrate sales in 2024, the Group was among the top three global SiC substrate manufacturers with a market share of 16.7%.

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The Group’s SiC materials empower the renewable energy and AI sectors. Its SiC substrates can be applied across various sectors, including electric vehicles, AI data centers, photovoltaic systems, AI glasses, rail transportation, power grids, household appliances and advanced telecommunication base stations.

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As of March 31, 2025, the Group was one of the few companies in the world capable of mass producing 8-inch SiC substrates, one of the first to commercialize SiC substrates ranging from a 2-inch to an 8-inch diameter and the first to introduce 12-inch SiC substrates.

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The Group mainly derived its revenue from sales of conductive SiC semiconductor material and semi-insulating SiC semiconductor material. As of March 31, 2025, the Group had established business relationships with over half of the top ten global power semiconductor device manufacturers.

BASIC INFORMATION
MarketHong Kong (Main Board)
Business NatureSemiconductors
Major Business AreaChina
Board Lot100
GLOBAL OFFERING
No. of Offer Shares47.75M H shares
No. of International Offer Shares31.03M H shares
No. of HK Offer Shares16.71M H shares
Offer Price$42.80
Stock Code2631
Sponsor(s)China International Capital Corporation Hong Kong Securities Limited, CITIC Securities (Hong Kong) Limited
Underwriter(s)China International Capital Corporation Hong Kong Securities Limited, CLSA Limited, Haitong International Securities Company Limited, BOCI Asia Limited, UOB Kay Hian (Hong Kong) Limited, The Hongkong and Shanghai Banking Corporation Limited, Zhongtai International Securities Limited, ICBC International Securities Limited, CMB International Capital Limited, CCB International Capital Limited, ABCI Securities Company Limited, GF Securities (Hong Kong) Brokerage Limited, China Galaxy International Securities (Hong Kong) Co., Limited, Shenwan Hongyuan Securities (H.K.) Limited, Futu Securities International (Hong Kong) Limited, Sun Securities Limited, Huafu International Securities Limited, Fosun International Securities Limited, Tiger Brokers (HK) Global Limited
TIME TABLE
Application PeriodAug 11 (Mon) - noon, Aug 15 (Fri)
Price Determination DateAug 18 (Mon)
Result Announcement DateOn or before Aug 19 (Tue)
Result Announcement DateOn or before Aug 19 (Tue)
Result Announcement DateOn or before Aug 20 (Wed)
Dealings in Shares commence onAug 20, 2025. (Wed)
Reallocation of Shares Offered
Times of HK Offer Shares Subscription15X - 50X50X - 100XOver 100X
% of total shares reallocated to HK Offer15%25%35%
Sales Statistics (HKD)
Offer Price$42.80
Capitalization (H Shares)2.04B
NAV / share ($)$16.34 (Unaudited pro forma adj NAV / share)
Use Of Proceeds
Assuming the offer price being at HKD 42.8, the net proceeds raised would be HKD 1.94B, of which
70% : Expand production capacity for 8-inch and larger SiC substrates
20% : Strengthen R&D capabilities
10% : Working capital
Related Document
Remark: The above information is referenced from the prospectus.
  All data is calculated from the non- exercise rights(if applicable).
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