00638 廣和通
FIBOCOM
FIBOCOM
| Register Close | 2025/10/17 IPO Closing Today |
| Listing Date | 2025/10/22 |
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IPO Detail
COMPANY PROFILE
Fibocom Wireless Inc. is a leading wireless communication module provider. The Group’s module products include data transmission modules, smart modules and AI modules. It provides customized solutions to its customers, including Edge AI solutions, robotic solutions and other solutions.
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The Group module products and solutions have a range of application scenarios, primarily including automotive electronics, smart home, consumer electronics and smart retail. According to report, in terms of revenue from continuing operations in 2024, the Group is the second largest wireless communication module provider globally with a market share of 15.4%. The Group rank the second globally in the automotive electronics application scenario with a market share of 14.4%, rank the first globally in the smart home application scenarios with a market share of 36.6% and rank the first globally in the consumer electronics application scenarios with a market share of 75.9%.
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In 2019, the Group collaborated with Intel to jointly launch one of the world’s first 5G data transmission modules and launched one of the world’s first 5G data transmission modules embedded with integrated blockchain technology. In 2020, the Group collaborated with China Unicom to jointly launch one of the world’s first 5G eSIM modules and one of China’s first 5G data transmission modules embedded with a domestic chip. The Group is one of the first companies in the world to launch smart modules and AI modules.
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As of October 6, 2025, the Group’s module products and solutions were sold in 34 countries and regions. To support the Group’s global operations, it had established ten subsidiaries and offices in overseas countries and regions, such as the United States, France, Germany, Singapore, Taiwan.
BASIC INFORMATION
| Market | Hong Kong (Main Board) |
| Business Nature | IT Hardware |
| Major Business Area | Global |
| Board Lot | 200 |
GLOBAL OFFERING
| No. of Offer Shares | 135.08M H shares |
| No. of International Offer Shares | 121.57M H shares |
| No. of HK Offer Shares | 13.51M H shares |
| Offer Price | $19.88 - $21.50 |
| Stock Code | 638 |
| Sponsor(s) | CITIC Securities (Hong Kong) Limited |
| Underwriter(s) | CLSA Limited, SDICS International Securities (Hong Kong) Limited, CMB International Capital Limited, ABCI Securities Company Limited, China Sunrise Securities (International) Limited, Futu Securities International (Hong Kong) Limited |
TIME TABLE
| Application Period | Oct 14 (Tue) - noon, Oct 17 (Fri) |
| Price Determination Date | Oct 20 (Mon) |
| Result Announcement Date | On or before Oct 21 (Tue) |
| Result Announcement Date | On or before Oct 21 (Tue) |
| Result Announcement Date | On or before Oct 22 (Wed) |
| Dealings in Shares commence on | Oct 22, 2025. (Wed) |
Reallocation of Shares Offered
Sales Statistics (HKD)
| Offer Price | $19.88 - $21.50 |
| Capitalization (H Shares) | 2.69B - 2.90B |
| NAV / share ($) | $7.20 - $7.43 (Unaudited pro forma adj NAV / share) |
Use Of Proceeds
| Assuming the offer price being at HKD 20.69, the net proceeds raised would be HKD 2.69B, of which |
| 55% : For R&D purpose, primarily including technical innovation and product development related to AI technologies and robotic technologies |
| 15% : Construction of a manufacturing facility in Shenzhen China |
| 10% : Repayment of bank borrowings |
| 10% : Strategic investments and acquisitions |
| 10% : Working capital |
Related Document
| Prospectus |  Chinese Version | English Version |
| Remark： | The above information is referenced from the prospectus. |
| All data is calculated from the non- exercise rights(if applicable). |
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*Admission fees include brokerage of 1%, SFC transaction levy of 0.0027%, Stock Exchange trading fee of 0.005% and FRC transaction levy of 0.00015% (i.e. 1.0077% in total).